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Senior Process Engineer, Test and Packaging

Rigetti Computing is developing full stack quantum computers to solve humanity’s most pressing and valuable problems. We are a highly diverse and interdisciplinary team of engineers and scientists working at the cutting edge of technology in a mission-driven entrepreneurial environment. We believe that bringing together teams from various cultures, educational backgrounds, and technical disciplines helps them to see things from more points of view and to make great products that change the world for the better.


As the Test & Packaging Engineer, you will be working in our state-of-the-art fabrication facility, Fab-1, where we build superconducting quantum integrated circuits developing and sustaining wafer/die electrical probing and die packaging equipment and process. You will spend your time immersed in the hands-on fabrication and measurement of these devices. You will work in a collaborative environment with a wide range of engineers, technicians and scientists in process integration, fab production, design, and quantum engineering teams.


Key Responsibilities
  • Wafer/Die/Package Testing:
  • Sustain wafer probe equipment to test electrical properties of superconducting quantum circuits.
  • Develop and deploy new test programs and functions on the equipment in a production environment.
  • Troubleshoot and resolve issues related to probe equipment and test procedures including but not limited to electrostatic damage (ESD).
  • Experience working with low level measurement and various types of probe cards and understanding their applications and resolution of related issues

  • Packaging:
  • Take ownership of assembly and packaging equipment and processes including, but not limited to: die attach, wire bonding, flip chip attach, wafer singulation, wafer bonding and other packaging processes.
  • Create packaging diagrams and specify requirements for assembly tooling, fixtures and equipment to support manufacturing operations and damage free die handling.


Additional Responsibilities
  • Support test, assembly and packaging development activities working through the evolution details of next generation process/architecture/product/approach, collaborating with other frontend and backend modules.
  • Establish process metrologies, key metrics, and parameters. Document and maintain monitors and statistical process controls to run a predictable and capable process.
  • Create specifications, document processes and written work instructions for production deployment.
  • Guide technicians and operators in process and equipment operation and troubleshooting. 
  • Maintain and monitor failure pareto from daily production activities, and recommend product and process improvements to enhance yield and efficiency.
  • Organize failure data, draw correlations from process interactions and present results in a concise fashion.
  • Prepare process requirement documents in defining and acquiring new equipment. Install and qualify new equipment and establish processes.
  • Key member of the team to continue developing Rigetti Fab as a leading quantum integrated circuit foundry.


About You
  • Disciplined hands-on approach to development work and technical problem solving.
  • MS and/or Ph.D. in Science or Engineering field is highly preferred.
  • At least 3-7+ years of hands-on experience in wide range of semiconductor/MEMS e-test, assembly and packaging tools, such as wafer probers, package probers, wire bonders, die attach, epoxy dispense, flip-chip assembly, surface mount technology (SMT), flux/solder (paste and solder balls), underfilling and cure, and relevant metrology tools. Hands-on experience in die-prep tools, such as wafer mount, wafer singulation, and die eject and handling. Familiar with temporary and permanent wafer bonding.
  • Strong understanding of semiconductor fabrication processes and electrical measurement instrumentation. Experience with superconducting materials is a plus.
  • Good understanding of cross-functional packaging areas is a definite plus. Familiarity in reviewing Silicon floor plan, package layout and architecture, thermal, mechanical, material, component & system level reliability, testing and failure analysis preferred.
  • Strong communication skills. Ability to work in a cross-functional team.
  • Ability to work independently and manage priorities and stakeholders. Ability to deal with ambiguity in defining activities and direction.
  • Strong background in SPC and DOE methodologies, GR&R, root-cause fixes and application of containment solutions.
  • Comfortable working in cleanroom fab adhering to HAZMAT and ESD practices.
  • High degree of comfort with a flexible and agile company environment. Flexibility in work hours and work days.
  • Comfortable with MS Office products, JMP, Solid Works, Google Docs. Experience with Python scripting and Data analysis is a plus.


$138,000 - $162,500 a year
Rigetti complies with all local and state regulations in regards to displaying salary ranges. Final compensation for this role will be determined by various factors such as a candidate’s relevant work experience, skills, and geographic location. Rigetti offers a full slate of benefits from competitive salaries, equity, medical, dental and vision paid at 98% for employees as well as rejuvenation days, a flexible vacation policy, commuter benefits, a 401(k) plan and paid parental leave program. 

As engineering leaders, we value diversity and are committed to building a culture of inclusion to attract and engage innovative thinkers. Our technology, meant to serve all of humanity, cannot succeed if those who built it do not mirror the diversity of the communities we serve. Applications from women, minorities, and other under-represented groups are encouraged.


About Rigetti

Rigetti Computing is a pioneer in full-stack quantum computing. The company has operated quantum computers over the cloud since 2017 and serves global enterprise, government, and research clients through its Rigetti Quantum Cloud Services platform. The company’s proprietary quantum-classical infrastructure provides ultra-low latency integration with public and private clouds for high-performance practical quantum computing. Rigetti has developed the industry’s first multi-chip quantum processor for scalable quantum computing systems. The company designs and manufactures its chips in-house at Fab-1, the industry’s first dedicated and integrated quantum device manufacturing facility. Rigetti was founded in 2013 by Chad Rigetti and today employs more than 130 people with offices in the United States, U.K., and Australia. Learn more at www.rigetti.com.


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Export Licensing Compliance

This position may require access to information protected under U.S. export control laws and regulations, including the International Traffic in Arms Regulations (ITAR) and/or the Export Administration Regulations (EAR).  Please note that any offer for employment may be conditioned on authorization to receive software or technology controlled under these U.S. export control laws and regulations without sponsorship for an export license. In order to ensure compliance, Rigetti must determine U.S. citizenship or U.S. visa/immigration status of all prospective applicants for this position.


Any citizenship information provided will be reviewed solely for export control compliance purposes.  Only applicants eligible to receive export-controlled items, software, technology, and information will be considered for this position.  Citizenship information will be handled in accordance with Rigetti’s policies prohibiting discrimination based upon classifications protected by federal, state, or local law.


Rigetti is committed to full compliance with applicable anti-discrimination laws. We are an equal opportunity employer and value diversity at our company. We strive to create an inclusive work environment and will not discriminate on the basis of race, religion, color, national origin, gender, sexual orientation, age, marital status, veteran status, or disability status.

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CEO of Rigetti Computing
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Chad Rigetti
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Average salary estimate

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$138000K
$162500K

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What You Should Know About Senior Process Engineer, Test and Packaging, Rigetti Computing

At Rigetti Computing, we're on the cutting edge of quantum technology, and we're looking for a Senior Process Engineer, Test and Packaging to join our dynamic team in Fremont, CA. In this exciting role, you'll work hands-on in our state-of-the-art fabrication facility, Fab-1, where we create superconducting quantum integrated circuits. This position involves sustaining wafer/die electrical probing and die packaging equipment and processes that are vital to our groundbreaking work. Your day-to-day will involve working closely with a team of talented engineers and scientists as you troubleshoot and resolve equipment issues and develop new test programs in a collaborative environment. You will have the opportunity to take ownership of packaging equipment and processes, ensuring that our revolutionary products meet the highest standards. With a focus on creating documentation, establishing metrologies, and guiding team members, your contributions will directly impact our manufacturing operations. If you have a disciplined, hands-on approach and are looking to be part of something big—solving humanity’s most pressing problems using quantum computing—this might be the perfect fit for you. Join us in building a diverse, inclusive culture where innovation thrives and great ideas come to life!

Frequently Asked Questions (FAQs) for Senior Process Engineer, Test and Packaging Role at Rigetti Computing
What is the role of a Senior Process Engineer, Test and Packaging at Rigetti Computing?

The Senior Process Engineer, Test and Packaging at Rigetti Computing is responsible for sustaining wafer probe testing equipment and developing new testing protocols while also handling assembly and packaging processes for superconducting quantum integrated circuits. This position plays a crucial role in ensuring the quality and efficiency of our production workflows.

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What qualifications are needed for the Senior Process Engineer position at Rigetti Computing?

To qualify for the Senior Process Engineer role at Rigetti Computing, candidates should possess at least an MS or Ph.D. in a Science or Engineering field along with 3-7+ years of hands-on experience with semiconductor/MEMS e-test and packaging tools. Familiarity with superconducting materials and strong communication skills are also important.

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What are the key responsibilities of a Senior Process Engineer at Rigetti Computing?

Key responsibilities of the Senior Process Engineer at Rigetti Computing include sustaining wafer probe equipment, developing test programs, troubleshooting equipment issues, guiding technicians, and documenting processes for production deployments. The role emphasizes collaboration with various engineering teams to enhance product quality and efficiency.

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How does Rigetti Computing support diversity in the workplace for the Senior Process Engineer role?

Rigetti Computing is committed to fostering a diverse workplace. The company encourages applications from women, minorities, and under-represented groups to build a culture of inclusion, ensuring the team reflects the communities we serve and driving innovation forward in the quantum computing field.

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What benefits can a Senior Process Engineer expect at Rigetti Computing?

The Senior Process Engineer at Rigetti Computing can look forward to competitive salaries, comprehensive health benefits, flexible vacation policies, and a 401(k) plan. In addition, the company values well-being with rejuvenation days and a paid parental leave program, making it a supportive place to work.

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Is hands-on experience essential for the Senior Process Engineer position at Rigetti Computing?

Yes, hands-on experience is crucial for the Senior Process Engineer position at Rigetti Computing. Candidates should have extensive practical knowledge of semiconductor testing and packaging tools to effectively contribute to the development and support of advanced quantum integrated circuits.

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What is Rigetti Computing’s mission for hiring a Senior Process Engineer?

Rigetti Computing’s mission for hiring a Senior Process Engineer is to find a skilled individual who can join our innovative team to develop and refine quantum computing technologies that address the world's most urgent challenges, contributing to research and practical applications in the field.

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Common Interview Questions for Senior Process Engineer, Test and Packaging
Can you explain the process of sustaining wafer probe equipment?

When answering this question, focus on detailing your experience with wafer probing, troubleshooting techniques, and how you've successfully sustained or improved testing equipment in previous roles. Highlight any methodologies you've employed to ensure optimal performance.

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What strategies do you use for developing new test programs in a production environment?

Discuss your approach to developing test programs by illustrating how you assess requirements, utilize equipment capabilities, and incorporate feedback from cross-functional teams. Emphasize any success stories or metrics that demonstrate your effectiveness.

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How do you troubleshoot and resolve issues related to probing procedures?

When tackling this question, outline your systematic approach to diagnosing issues. Use specific examples to showcase your problem-solving skills and your ability to work collaboratively with other team members to implement effective solutions.

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What types of packaging processes are you experienced with?

In your response, emphasize your experience with various packaging processes such as die attach, wire bonding, and flip-chip assembly. Provide examples from prior roles where your skills in packaging directly contributed to production efficiency.

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How do you document processes and create specifications for production?

Explain your methodology for documenting processes, including how you ensure clarity and compliance with industry standards. Provide examples of documentation you’ve created which helped facilitate better understanding and execution in manufacturing operations.

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What is your experience with failure analysis within semiconductor packaging?

Share specific experiences where you’ve conducted failure analysis, detailing the steps you took to identify issues and how you contributed to resolving them. Highlight any documentation or presentations you created to share findings with your team.

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Can you describe a time when you had to guide technicians on complex processes?

Use this opportunity to showcase your leadership and communication skills. Describe a scenario where you provided training or guidance, including the techniques you used to ensure technicians understood complex processes effectively.

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What tools or software are you proficient in for process analysis?

Mention any software tools you are proficient in such as JMP, Python, or Solid Works. Explain how you’ve utilized these tools for data analysis and process improvement in past projects.

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How do you prioritize multiple tasks in a fast-paced engineering environment?

Discuss your organizational and time management skills. Provide insights into how you assess task urgency and importance, and include strategies you've applied to ensure you meet project deadlines while maintaining quality.

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What steps would you take to install and qualify new equipment?

In your response, outline the steps you would undertake in installing and qualifying equipment. Highlight your attention to detail and thoroughness, ensuring that the equipment meets operational standards before being used in a production setting.

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We’re on a mission to build the world’s most powerful computers to help solve humanity’s most important and pressing problems. We build and deliver integrated quantum-classical systems through our Quantum Cloud Services platform to help our custom...

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Full-time, on-site
DATE POSTED
November 27, 2024

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