Senior Technical Leader, Advanced Packaging

Job Summary

A company is looking for a Distinguished Technical Staff, Advanced Packaging Strategic Initiatives.

Key Responsibilities

• Owns companywide 2D, 2.5D, and 3D packaging roadmap and technology development
• Works closely with current module partners to create differentiation for products
• Drives long-term partnerships for all forward-looking packaging related technology development

Required Qualifications, Training, and Education

• MS or PhD in Electrical Engineering, Photonics, or related field
• 15+ years of experience in optical and CMOS packaging, with a preference for direct experience in bringing new technology to market
• Proven leadership in the advanced packaging space, focusing on interconnect products and chiplets
• Extensive experience with advanced packaging technologies such as CoWoS and die stacking
• Strong understanding of packaging challenges and risk assessment